Bondtech CHT, E3D Revo Heatcore Clash on CHT Patent
The US patent for CHT was seemingly rejected in the US, while E3D opposes the patent in Europe.
Last week saw a bit of legal back-and-forth on Twitter regarding Bondtech CHT, E3D Revo Heatcore, and Core Heating Technology (CHT). The drama centers on a rejected United States patent for CHT, with E3D opposing the patent in Europe.
Bondtech asserts that “the CHT technology licensed by Bondtech is showing to be very valuable to our customers and superior to our competitors’ solutions.” As such, it “is committed to assist Carl Beck in protecting his IP in both Europe and the US.”
Beck’s 3DSolex Core Heating nozzles, first introduced in 2016, opened the doors for developing the Bondtech Core Heating Technology. The implications for a patent on CHT could be far-reaching, with one Twitter user touting the technology as “one of the game-changers of last year in FDM printing.”
A patent’s rejection, however, is relatively common and certainly doesn’t mean the end for Bondtech’s efforts. Regarding the matter, Bondtech tweeted: “As an innovative company, we believe to be well positioned to convert CHT’s added value into research and development that will benefit our community.”
Lead image source: Bondtech
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